Asia Express - Mobile Communications
Intel, Rockchip Team up to Launch Low-cost 3G Solutions
April 14, 2015

Intel and China-based chip maker Rockchip announced the mass production of their first co-developed chip SoFIA 3G-R, with a plan to ship around 10 million chips by the end of the year, reported China's 21st Century Business Herald on April 14. The chip, which aims to take on MediaTek's low-cost solutions, can be used in both tablets and entry-level smartphones. Rockchip said that Intel's baseband technology and portfolios of intellectual property is expected to strengthen its product lines. Rockchip signed a cooperation deal with Intel in May 2014. The two companies will continue to cooperate on 4G and 16-nm chips in the future.